die bonding
英 [daɪ ˈbɒndɪŋ]
美 [daɪ ˈbɑːndɪŋ]
网络 黏晶机; 芯片键合; 固晶; 芯片焊接; 片接合
双语例句
- In the measurement procedures of die bonding process, we apply infrared system to measure the thermal resistance and use bonding tester to estimate the die shear strength.
特性量测选用扫描式超音波显微镜检测黏著状态、稳态红外线热阻量测法检测热阻以及使用推拉力机量测黏著强度，再藉由这些特性量测做性能分析。 - Using the silver paste and epoxy resin as die bonding materials, two kinds of power LEDs are made.
分析了功率型LED热阻系统的构成，对采用银浆和环氧胶作为芯片键合材料的功率型LED热阻进行了对比研究。 - Development of high precision three-holder die set for bonding crystal ball
三模座高精度水晶粘球模架设计与制造 - Wafer chip scale packaging ( WCSP) eliminates conventional packaging steps such as die bonding, wire bonding, and die level flip chip attach processes.
晶圆级芯片尺寸封装（WCSP）消除了类似传统的芯片键合、引线键合和倒装芯片贴装过程的封装工序。 - Compared with the prior art, the mechanical structure greatly enhances the efficiency of the die taking and the die bonding, and can obtain very high precision by setting appropriate parameters.
本机械结构较之现有技术，大大提高了取晶固晶的效率，设置适当的参数，可获得很高的精度。 - Failure Mode of Die Bonding and Improved Path of Bonding Strength
芯片粘接失效模式及粘接强度提高途径 - The experiment result shows that using the silver paste as the die bonding material, the thermal conductivity of power LED is greatly improved. Its thermal resister is 100 ℃/ W lower than that using the epoxy resin as the die bonding material.
研究结果表明：采用银浆作为芯片键合材料可以显著改善功率型LED的热阻系统，同采用环氧胶作为芯片键合材料的功率型LED相比，其热阻下降了约100℃/W。 - Die bonding is one of the important processes to manufacture the IC components, which must make in the die bonder.
键合是IC元件生产的重要封装过程或工序，需要在芯片键合机上完成。 - The results from encapsulation peel tests, die and encapsulant pull tests, bonding wire pull tests and C-Mode SAM ( C-SAM) examination are presented. This paper demonstrates that the optimized plasma cleaning process would enhance PBGA package qualification level and improve the process yields and productivity.
陈述了密封剥离试验、芯片和密封剂拉力试验、焊线拉力试验和C-模式SAM（C-SAM）检查的结果，证明了最佳的等离子清洗工艺会增强PBGA封装的定性等级，并提高工艺效率和生产率。 - Through experiments with aluminous sheets, punch bonding mechanism and die designing are studied and main affecting factors on bonding strength characteristics are analyzed.
本文通过对铝板件进行冲压连接实验，研究了这种冲压连接技术的机理和冲压模具设计，并重点分析了影响连接强度特性的主要因素。 - Study of die bonding technology for Cu/ Sn isothermal solidification
Cu/Sn等温凝固芯片键合工艺研究 - The Choosing Method For Die Bonding Machine
芯片粘接设备的选择策略 - Precise amount is a basic requirement in the process of die bonding.
在滴胶过程中能够得到一致性较好的滴胶效果，是芯片粘接的基本要求。 - Study of failure modes for die bonding by Au/ In isothermal solidification
Au/In等温凝固焊接失效模式研究 - Thermal mismatch induced by the die bonding structure greatly affects the reliability and performance of MEMS devices.
芯片粘接工艺引起的器件-封装热失配会对MEMS器件的可靠性和性能产生显著影响。 - The Software Control Systems in Die Bonding Experiment
芯片粘接实验软件控制系统 - Hybrid Approach for Improving the Reliability of Die Bonding Process
改进晶片键合质量可靠性的综合分析方法 - Effects of Die Bonding on MEMS Characteristics: Cell Library
芯片粘接工艺对MEMS性能影响的单元库法模型 - Die bonding plays a key role in effecting the quality and efficiency of IC production. The rapid development brings a challenge to the system in utmost stroke, speed, acceleration and accuracy.
芯片封装是影响IC制造产品性能和生产效率的关键环节，芯片封装等领域的迅速发展对定位系统的行程、速度、加速度和精度的极限性提出挑战。 - Eutectic Die Bonding Technology and Its Applications in MEMS Packaging
基于共晶的MEMS芯片键合技术及其应用 - Analysis and simulation of thermal characteristic on die bonding materials of power LED
功率LED芯片键合材料对器件热特性影响的分析与仿真 - Compensating the Error in Z Axis in the Process of Die Bonding
滴胶过程中的Z轴误差补偿 - But it is not suit for precision dies, such as the folding and riveting die for the stators and rotators of motors. For precision dies, the method of bonding the guide bushes with glue is applicable.
但此方法用于精密模具（如电机定转子叠铆模）则有一定的弊端，用胶水粘接导套的方法可适用于精密模具。 - By orthodoxy test, die felting and bonding were optimized, so reliability and process consistence of the batch product were ensured.
通过正交试验优化了粘片和键合两个关键工序，保证了产品批量生产的可靠性和工艺一致性。 - Wafer Quality Detecting System of Automatic Die Bonding Machine
全自动上芯机的晶片检测系统 - Based on the theory of IS, this thesis aims at exploiting a new die bonding method of practical value in consistence with most common technique used in modem electronic package manufacture at present.
本论文的目的是根据目前封装工业中现有的芯片焊接工艺，以等温凝固原理为基础开发一种新型具有实用价值的芯片焊接方法。 - The main contents are: 1. A detailed study of die bonding holes thermal properties of the device.
主要内容为：1.详细研究了粘片空洞对器件热性能的影响。 - Die bonding process using soft solder, the main problems is the die bonding holes.
粘片采用软焊料粘片工艺，所存在的主要问题是粘片空洞。